If the next generation USB standard splits, the ultimate victim may be PC users.
AMD and other companies called Intel "overbearing"
According to foreign media reports, AMD and NVIDIA accused Intel of crowding out other competitors in the process of formulating the next generation USB3.0 transmission standard and experiencing the hidden rules of Suzhou Mobile. They are cooperating with VIA to develop the next generation USB3.0 transmission standard, and will hold several first meetings on this standard next week.
USB is an absolute universal standard in IT field. 1995, Intel, together with Microsoft, Hewlett-Packard, Texas Instruments, NEC, NXP and other manufacturers, formed the "USB Executive Forum", which is the institution that formulated and promoted USB standards to experience the hidden rules of Suzhou Mobile.
After the release of the first two generations of USB standards, Intel caused dissatisfaction with AMD and NVIDIA when formulating the third generation standard.
AMD insiders pointed out, "Intel refuses to provide detailed specifications of USB3.0 standard to any vendors that compete with them in CPU and chipset fields, including AMD, NVIDIA and VIA."
AMD said that Intel has mastered USB3.0 technology and standards, and will only disclose the technology to other manufacturers after monopolizing USB3.0 support on its own motherboard for 6 to 9 months, resulting in other manufacturers being "technologically backward" due to human factors.
Intel denies late charges.
Looking at the development of the PC industry, it is nothing new for Intel to suppress its rivals by virtue of its strong position in standard setting. The latest example is March this year. In order to prevent NVIDIA from acquiring VIA, it is widely rumored in the industry that Intel banned the motherboard chip business in NVIDIA by not opening the next generation FSB specification "QuickPathInterconnect" to NVIDIA.
The USB executive forum led by Intel denied the opponent's accusation. The design of USB3.0 bus controller has not been finalized. Once it is finalized, they will announce, "This is something that Intel has invested a lot of money and manpower to develop. When we finalize it, we will authorize it to the whole industry."
Two sets of standards for next-generation USB?
According to the development of the situation, consumers may encounter two different USB standards on PC products next year, one is the original Intel version, and the other is the AMD/NVIDIA/VIA version. Although the latter is designed to be compatible with Intel standards, the two standards may not be compatible under Intel's "ban".
The product manager of Gigabyte, a motherboard manufacturer, said that if two sets of different USB standards appeared and Suzhou Mobile's hidden rules were experienced, motherboard, PC and digital product manufacturers would be at a loss, and consumers would have to pay for the increased costs.
●USB3.0
USB3.0 is the next generation high-speed connection standard, which is expected to be launched in 2009. The significance of USB3.0 standard is that almost all connections between computers, peripherals and digital products in the future must follow this standard. The data transmission rate of USB3.0 can reach 10 times that of USB2.0, which is widely used at present, that is, 5 GB/s.
Related topic articles:
Looking forward to hearing the effect of "big beads and small beads fall into one plate" ...
Experience the hidden rules of Suzhou Mobile. An American man found a ring lost 27 years ago in the swimming pool.